TOP LUCINA BVF |
TOP LUCINA BVF BASE |
5ml/L |
Additive for exclusively via-filling plating. Excellent via-filling effect and filling to large diameter via-holes is possible |
TOP LUCINA BVF-2 |
1.5ml/L |
TOP LUCINA BVF-LEVELLER |
0.5ml/L |
CURRENT DENSITY |
2ASD |
TOP LUCINA α |
TOP LUCINA α-M |
4.5ml/L |
Additive for via-filling applicable to through-holes and pattern plating. Less formation of void and applicable to via-holes for 30 to 130 µm |
TOP LUCINA α-2 |
1ml/L |
TOP LUCINA α-3 |
3ml/L |
CURRENT DENSITY |
1ASD |
TOP LUCINA FA |
TOP LUCINA FA-1 |
5ml/L |
Additive applicable to via-filling plating using insoluble anodes. Excellent filling effect and less decrease in filling effect |
TOP LUCINA FA-2 |
0.4ml/L |
TOP LUCINA FA-3 |
4ml/L |
CURRENT DENSITY |
1.5ASD |
TOP LUCINA NSV |
TOP LUCINA NSV-1 |
4ml/L |
Additive applicable to high throwing bath. Excellent throwing power and suitable for application to package substrate having fine pattern |
TOP LUCINA NSV-2 |
0.5ml/L |
TOP LUCINA NSV-3 |
1ml/L |
CURRENT DENSITY |
1ASD |
TOP LUCINA RF |
TOP LUCINA RF |
0.5ml/L |
Refreshing agent to solve deterioration of via-filling bath. As will not remain in the bath, remedy in a short period is possible |
TOP LUCINA RF-CLF |
TOP LUCINA RF-CLF |
30ml/L |
Non-chlorine type refreshing agent. Suitable for application to Top Lucina NSV bath which has extremely low concentration of chlorine ion |
TOP LUCINA HG |
TOP LUCINA HG |
5ml/L |
Additive to accelerate dissolution of mono-valent copper. Reduce anode sludge and enhance stability of filling effect. |