Clean & Conditioner |
OPC-380 Condiclean M |
General purpose alkali cleaner and conditioner |
ATS Precondition PIW-1 |
Forming fine roughness to polyimide surface |
ATS Condiclean CIW-2 |
Conditioner to Improve adhesion of electroless copper plating on polyimide surface |
Soft Etching |
OPC-460 Softetch |
Hydrogen peroxide liquid etching agent. Provide economical operation |
Pre-Dipping |
OPC-Predip AD |
Pre-dipping agent for alkali process. Improve better adhesion of catalyst |
OPC-H TEC Predip |
Pre-dipping agent for horizontal process |
Catalyzing |
OPC-80 Catalyst |
Catalyzing agent that give Pd ion. Has excellent liquid stability and catalytic-adsorption |
OPC-80 Catalyst M |
Excellent bath stability and durability |
OPC-H TEC Catalyst |
Alkali catalyzing agent. Suitable for horizontal process |
Accelerating |
OPC-505 Accelerator |
Durability by wide allowable range of Sn (Non-fluoride-based) |
OPC-555 Accelerator |
Strongly activate palladium metal as fluoride-containing acid liquid |
OPC-H TEC Reducer |
Accelerator for horizontal process |
Electroless Copper plating |
OPC-750 E’less M |
EDTA type additive and Suitable for Build-up PCB |
ATS - Addcopper IW |
Rochelle salt type additive with cyanide-free. Provide adhesion to substrate and enhance blister-free |
ATS – Addcopper VR |
Provide coating on the copper uniformly and applicable to RF-PCB with a good adhesion |