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ELECTROLESS COPPER
PLATING PROCESS

Introduces products using advanced surface treatment technology of MK Chem & Tech

  • Electroless copper plating process

    Process Brand Name Features
    Clean &
    Conditioner
    OPC-380 Condiclean M General purpose alkali cleaner and conditioner
    ATS Precondition PIW-1 Forming fine roughness to polyimide surface
    ATS Condiclean CIW-2 Conditioner to Improve adhesion of electroless copper plating on polyimide surface
    Soft Etching OPC-460 Softetch Hydrogen peroxide liquid etching agent. Provide economical operation
    Pre-Dipping OPC-Predip AD Pre-dipping agent for alkali process. Improve better adhesion of catalyst
    OPC-H TEC Predip Pre-dipping agent for horizontal process
    Catalyzing OPC-80 Catalyst Catalyzing agent that give Pd ion. Has excellent liquid stability and catalytic-adsorption
    OPC-80 Catalyst M Excellent bath stability and durability
    OPC-H TEC Catalyst Alkali catalyzing agent. Suitable for horizontal process
    Accelerating OPC-505 Accelerator Durability by wide allowable range of Sn (Non-fluoride-based)
    OPC-555 Accelerator Strongly activate palladium metal as fluoride-containing acid liquid
    OPC-H TEC Reducer Accelerator for horizontal process
    Electroless
    Copper
    plating
    OPC-750 E’less M EDTA type additive and Suitable for Build-up PCB
    ATS - Addcopper IW Rochelle salt type additive with cyanide-free. Provide adhesion to substrate and enhance blister-free
    ATS – Addcopper VR Provide coating on the copper uniformly and applicable to RF-PCB with a good adhesion
    After using PIW-1 on polyimide After using IW Competitor’s on Cu plate
    After plating electro-cu
    (1㎛)s

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