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ENIG (Electroless Nickel / Immersion Gold) PROCESS

Introduces products using advanced surface treatment technology of MK Chem & Tech

  • ENIG (Electroless Nickel / Immersion Gold) PROCESS

    Process Brand name Features
    Cleaning OPC Acid Clean 115 Suitable for cleaning of general purpose
    Acid Clean 125 Acid cleaning for electroless gold plating with improved wettability
    Acid Clean 320 Excellent ability to remove organic matter and prevent solder skips
    Soft-etching Oxone PS-16 Micro-etchants of Potassium Monopersulfate series
    Catalyzing ICP Accera H
    ICP Accera H2    		 Palladium catalyst of Hydrochloric acid-based (Pd 1.2g /Lt)
    ICP Accera KCR-10
    CATA KCR-20    		 Palladium catalyst of sulfuric acid-based (Pd 1.0g /Lt)
    Electroless
    Ni-P    		 ICP Nicoron GIB A medium phosphorous nickel coating optimized for fine patterns (P 6~9%)
    ICP Nicoron FPF Highly ductile nickel coating optimized for Flexible PCB
    ICP Nicoron SOF A high nickel phosphorous coating (P 10~12%)
    Immersion Au OPC Muden Gold AD Produce a process with a standard deviation in gold thickness far below that of any competing system
    IM-Gold IB Give uniform and fine coating having excellent adhesion (Slightly acid)
    IM-Gold CN Minimizes oxidation and erosion of nickel

  • ENIG (Electroless Nickel / Immersion Gold) PROCESS

    Brand name Nickel (g/Lt) PH Temp(℃) P(%) Deposition rate(㎛/h)
    ICP Nicoron GIB 4.7 ~ 5.3 4.4 ~ 4.6 82 ~ 86 6 ~ 9 11 ~ 13
    ICP Nicoron FPF 4.5 ~ 5.5 4.5 ~ 4.7 80 ~ 85 6 ~ 9 9 ~ 11
    ICP Nicoron SOF 5.5 ~ 6.5 4.7 ~ 4.9 83 ~ 88 9 ~ 11 11 ~ 13
    Ni surface morphology Ni layer's comparison of cross section
    General purpose ICP Nicoron GIB ICP Nicoron FPF ICP Nicoron SOF
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